4016

Technical Summary: HCC/HCF4016B Quad Bilateral Switch

Overview

The HCC4016B and HCF4016B are quad bilateral switches designed using CMOS technology, offering low power consumption and high noise immunity. These devices are part of the "B" series CMOS family, which provides enhanced performance over standard CMOS components. The HCC4016B is specified for extended temperature ranges, while the HCF4016B is intended for intermediate temperature ranges. These switches are widely used in signal routing, modulation, and multiplexing applications due to their bidirectional signal handling capability and low ON resistance.

Key Features

• Quad Bilateral Switch: Four independent switches in a single package.
• Low ON Resistance: Typically 125Ω (at V_DD = 10V).
• Wide Supply Voltage Range: 3V to 18V operation.
• High Noise Immunity: CMOS technology ensures robust performance in noisy environments.
• Low Power Consumption: Ideal for battery-operated applications.
• Bidirectional Signal Handling: Signals can pass in either direction when the switch is ON.
• Break-Before-Make Switching: Prevents signal overlap during switching transitions.
• Temperature Ranges: HCC4016B (-40°C to +125°C), HCF4016B (-40°C to +85°C).

Applications

The HCC/HCF4016B is versatile and finds use in a variety of electronic circuits, including:

• Analog Signal Switching: Audio and video signal routing.
• Digital Multiplexing: Data selection in communication systems.
• Modulation/Demodulation: Used in RF and telecommunication circuits.
• Sample-and-Hold Circuits: Precision signal acquisition.
• Oscillator and Filter Networks: Frequency control and signal conditioning.
• Battery-Powered Devices: Low power consumption makes it suitable for portable electronics.

Electrical Characteristics

The following table summarizes the key electrical specifications for the HCC/HCF4016B:

• Supply Voltage (V_DD): 3V to 18V
• Input Voltage (V_IN): 0V to V_DD
• ON Resistance (R_ON): 125Ω (typical at V_DD = 10V)
• OFF Leakage Current (I_OFF): ±10nA (max at V_DD = 18V)
• Propagation Delay (t_PD): 60ns (typical at V_DD = 10V)
• Power Dissipation (P_D): 500mW (max)
• Input Capacitance (C_IN): 5pF (typical)

Package Information

The HCC/HCF4016B is available in multiple package options to suit different assembly and thermal requirements:

• Plastic DIP (HCF4016BEY): 14-pin Dual Inline Package, suitable for through-hole mounting.
• Ceramic Frit Seal (HCF4016BC1): 14-pin ceramic package, offering high reliability for harsh environments.
• Plastic Chip Carrier (HCF4016BF): Surface-mount package for compact PCB designs.
• Micro Package (HCF4016BM1): Miniature form factor for space-constrained applications.

Pin Configuration

The pin connections for the HCC/HCF4016B are as follows:

• Pin 1: Control Input for Switch 1
• Pin 2: Input/Output for Switch 1
• Pin 3: Output/Input for Switch 1
• Pin 4: Control Input for Switch 2
• Pin 5: Input/Output for Switch 2
• Pin 6: Output/Input for Switch 2
• Pin 7: Ground (V_SS)
• Pin 8: Output/Input for Switch 3
• Pin 9: Input/Output for Switch 3
• Pin 10: Control Input for Switch 3
• Pin 11: Output/Input for Switch 4
• Pin 12: Input/Output for Switch 4
• Pin 13: Control Input for Switch 4
• Pin 14: Supply Voltage (V_DD)

Functional Description

The HCC/HCF4016B consists of four independent bilateral switches, each controlled by a digital input. When the control input is high (logic "1"), the switch is ON, allowing signals to pass bidirectionally between its input and output pins. When the control input is low (logic "0"), the switch is OFF, presenting a high impedance between the terminals. The switches exhibit break-before-make action, ensuring no short-circuit occurs during switching transitions.

Design Considerations

• Power Supply Decoupling: A 0.1µF ceramic capacitor should be placed close to V_DD and V_SS to minimize noise.
• Signal Integrity: Keep trace lengths short for high-frequency signals to reduce parasitic effects.
• Unused Switches: Leave control inputs of unused switches tied to V_SS to minimize power consumption.
• ESD Protection: Handle with appropriate ESD precautions to prevent damage to the CMOS inputs.

Ordering Information

The following order codes are available for the HCC/HCF4016B:

• HCC4016BF: Plastic Chip Carrier package
• HCF4016BM1: Micro Package
• HCF4016BEY: Plastic DIP package
• HCF4016BC1: Ceramic Frit Seal package